Bitte fragen Sie unsere Hilfe, um die Ursache der nächsten Herstellungsprobleme herauszufinden:
- Tombstones of resistances
- QFP soldering errors
- PAD wetting faults
- BGA faults
- Etc.
Um die Fehler zu analysieren, verwenden wir folgende Methoden:
- Optical microscope
- X-ray microscope
- Cross stitch – the cross section is intended for a flat surface with minimal surface roughness, in order to explore the internal structure of the sample
- Shear testing –shear strength of BGA balls
- BGA dyeing test – This is an analytical method that is a special coloring fluid relying on the existing cracks in the BGA spheres.
- Electron microscope – allows large, grayscale micrographs of the surface of the sample up to 100,000x magnification.
